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An Open Hardware Bioprinter Part I: A bioextruder with a peristaltic pump approach

  • Piero G. Latorre-Quevedo
  • , Omar A. Romero-Rodriguez
  • , Mauricio L. Ramos-Gallegos
  • , Ashley E. Bravo-Bravo
  • , Alen Zimic-Sheen
  • , Lizardo K. Torres-Ayala
  • , Denis Castillo
  • Pontificia Universidad Católica del Perú
  • Universidad Peruana Cayetano Heredia, Facultad de Medicina Alberto Hurtado
  • Universidad Peruana Cayetano Heredia

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study presents the development and characterization of an open source bioextruder for 3D bioprinting, focusing on its application in research laboratories in South America. Bioextruder design is based on several requirements, the design was manufactured using techniques of 3D printing and its electronic control is managed using an Arduino Mega and Ramps 1.4 shield. The paper evaluates mechanical and biological properties, demonstrating that the flow behavior of alginate through the bioextruder is influenced by its concentration, viscosity, and extrusion rate. Results: As for the mechanical characterization test, for low alginate concentrations high velocities show stable extrusion values, while for high concentrations, a low velocity gives stable results. Strand thickness consistent results were obtained with respect to the width of the prints. It is also shown that cell viability decreases as the extrusion speed increases. Conclusion: This research demonstrates a successful bioextruder for precise 3D bioprinting, emphasizing open-source hardware's significance particularly in resource-limited regions like Latin America.

Original languageEnglish
Title of host publicationProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350315578
DOIs
StatePublished - 2023
Event30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023 - Lima, Peru
Duration: 2 Nov 20234 Nov 2023

Publication series

NameProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023

Conference

Conference30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
Country/TerritoryPeru
CityLima
Period2/11/234/11/23

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Keywords

  • 3D printers
  • bioprinting
  • open-hardware
  • tissue engineering

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