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An Open Hardware Bioprinter Part I: A bioextruder with a peristaltic pump approach

  • Piero G. Latorre-Quevedo
  • , Omar A. Romero-Rodriguez
  • , Mauricio L. Ramos-Gallegos
  • , Ashley E. Bravo-Bravo
  • , Alen Zimic-Sheen
  • , Lizardo K. Torres-Ayala
  • , Denis Castillo
  • Pontificia Universidad Católica del Perú
  • Universidad Peruana Cayetano Heredia, Facultad de Medicina Alberto Hurtado
  • Universidad Peruana Cayetano Heredia

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

This study presents the development and characterization of an open source bioextruder for 3D bioprinting, focusing on its application in research laboratories in South America. Bioextruder design is based on several requirements, the design was manufactured using techniques of 3D printing and its electronic control is managed using an Arduino Mega and Ramps 1.4 shield. The paper evaluates mechanical and biological properties, demonstrating that the flow behavior of alginate through the bioextruder is influenced by its concentration, viscosity, and extrusion rate. Results: As for the mechanical characterization test, for low alginate concentrations high velocities show stable extrusion values, while for high concentrations, a low velocity gives stable results. Strand thickness consistent results were obtained with respect to the width of the prints. It is also shown that cell viability decreases as the extrusion speed increases. Conclusion: This research demonstrates a successful bioextruder for precise 3D bioprinting, emphasizing open-source hardware's significance particularly in resource-limited regions like Latin America.

Idioma originalInglés
Título de la publicación alojadaProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9798350315578
DOI
EstadoPublicada - 2023
Evento30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023 - Lima, Perú
Duración: 2 nov. 20234 nov. 2023

Serie de la publicación

NombreProceedings of the 2023 IEEE 30th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023

Conferencia

Conferencia30th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2023
País/TerritorioPerú
CiudadLima
Período2/11/234/11/23

ODS de las Naciones Unidas

Este resultado contribuye a los siguientes Objetivos de Desarrollo Sostenible

  1. ODS 9: Industria, innovación e infraestructura
    ODS 9: Industria, innovación e infraestructura

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